Package Intersil W8x9.72B — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W8x9.72B
72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Rev 0, 12/15
X 3.608 В±0.030 Y 0.400
J
72x 0.265 В±0.035 H
G
F 4.009 В±0.030 E
D
C
0.405 B
A
(4X) 0.10 1
PIN 1 (A1 CORNER) 2 4 5 6 7 8
0.404 0.200 TOP VIEW BOTTOM VIEW Z
PACKAGE
OUTLINE 0.215 3 0.05 Z SEATING PLANE
3 0.400
0.265 0.265 В±0.035 6 NSMD Z X Y 0.05 Z 0.200 В±0.030
0.500 В±0.050 RECOMMENDED LAND PATTERN NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance and tolerance per ASMEY 14.5 -1994. …