Package Intersil W5x7.28 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x7.28
28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 7/12
1.600 X
2.185В±0.02 Y 0.800 G G F F E E 0.400 2.92В±0.02 (2X) 0.10 5 4 3 2 28X 0.260В±0.03 D D C C B B A A 1.600
2.400 1 1 2 5
4
0.400 3 PIN 1 (A1 CORNER)
TOP VIEW BOTTOM VIEW
PACKAGE
OUTLINE
0.225 0.400
0.275 0.305В±0.025 0.505В±0.40 0.200В±0.03
0.400 TYPICAL RECOMMENDED LAND PATTERN SEATING
PLANE
0.05 Z
Z 0.260В±0.03
0.050
0.015 ZXY
Z SIDE VIEW
NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994. …