Package Intersil W5x5.25B — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x5.25B
5X5 ARRAY 25 BALL WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 2, 12/11
X Y 1.60 2.11В±0.03
25x 0.225В±0.03
E
D
0.40 2.13В±0.03 1.60 C
B 0.265 A 0.10
PIN 1 (A1 CORNER) (4X)
TOP VIEW 1 2 3 4 0.254 5
0.40 BOTTOM VIEW 0.25 PACKAGE
OUTLINE 0.305В±0.025
0.225
0.55 MAX
0.40 Z SEATING PLANE 0.19В±0.03
3 0.25В±0.03 NSMD TYPICAL RECOMMENDED LAND PATTERN 0.10
0.05 ZXY
Z 0.05 Z SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994,
and JESD 95-1 SPP-010. …