Package Intersil W8x9.72 — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW8x9.72
Package Intersil W8x9.72

8x9 Array 72 Balls Wafer Level Chip Scale Package

Parameter

FamilyWLCSP-BP
Pin Count72
Length4.46 mm
Width3.96 mm
Height max0.66 mm
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW8X9.72

Modellreihe

Herstellerklassifikation

  • Plastic Packages