Package Intersil W4x6.24 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x6.24 4X6 ARRAY 24 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 1, 9/10
1.60В± 0.02 24X 0.270 В± 0.03 1.20 PIN A1
F
E
D
2.40В± 0.02 2.00
C
B
0.40
A
1 TOP VIEW 2 3 4 BOTTOM VIEW
0.305 В± 0.025
0.55 mm MAX Z SEATING PLANE 0.19 В± 0.03 0.27 В± 0.03 0.05 Z Г?0.10 M Z X Y
Г?0.05 M Z
SIDE VIEW 0.275 PACKAGE
OUTLINE
NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994,
and JESD 95-1 SPP-010.
3. NSMD refers to Non-solder Mask Defined pad design per …