Package Intersil W3x4.12C — Datenblatt

HerstellerIntersil
SerieWLCSP
ArtikelnummerW3x4.12C
Package Intersil W3x4.12C

12 BALL WAFER LEVEL CHIP SCALE PAKET (WLCSP 0,40 mm Abstand)

Package Outline Drawing (POD)

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Parameter

FamilyWLCSP-BP
Pin Count12
Length1.69 mm
Width1.39 mm
Thickness0.01 mm
Height max0.02 mm
Weight0.0040 g
Pitch0.02 mm
Lead Free Peak Temperature260 °C
Package IndexW3X4.12C

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