Package Intersil W7x8.56A — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W7x8.56A
56 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)
Rev 0, 6/14
X Y 2.400 3.22 В±0.030
H
G
56x 0.265 В±0.035 F
E 3.37 В±0.030 2.800
D
0.400
C
B 0.285 A
(4x) 0.10 1 2 3 4 5 6 7 PIN 1 (A1 CORNER)
0.410 0.400
TOP VIEW
BOTTOM VIEW Z
0.05 Z PACKAGE OUTLINE SEATING PLANE
3 0.240 0.290
2
0.265 В±0.035
0.10 M Z X Y
0.05 M Z 0.400 4 0.200 В±0.030 6 NSMD …