Package Intersil W6x7.42 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W6x7.42
42 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.40mm PITCH)
Rev 0, 2/15
X
Y 0.400 2.80 В±0.030 G
42x 0.265 В±0.035 F
E 3.20 В±0.030 D
C
B 0.400 A
1 0.10 (4X) PIN 1 (A1 CORNER) 2 4 5 6 0.200 TOP VIEW 0.400
BOTTOM VIEW Z PACKAGE
OUTLINE 0.240 3 0.05 Z SEATING PLANE
3 0.290
2
0.400 6 NSMD 0.200 В±0.030
0.500 В±0.050 TYPICAL RECOMMENDED LAND PATTERN
SIDE VIEW NOTES:
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