Package Intersil W5x5.25 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W5x5.25
5X5 ARRAY 25 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 1, 2/13
2.000 2.600 В±0.030 X 25X 0.320 В± 0.030 Y E
D
2.600 В±0.030
C
B
0.500
A
0.10
(4X) 0.300
1 PIN 1 (A1 CORNER) 2 3 4 5 0.500 TOP VIEW 0.300
BOTTOM VIEW PACKAGE OUTLINE 0.330 0.280 0.540В±0.040mm 0.500 0.240 В± 0.030 0.320 В± 0.030 X25
0.10
0.05 3 NSMD ZXY
Z TYPICAL RECOMMENDED LAND PATTERN Z SEATING
PLANE
0.05 Z SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994,
and JESD 95-1 SPP-010. …