Package Intersil W4x5.20N — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x5.20N
20 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch) (With BSC)
Rev 0, 2/15 X 0.400 1.74 В±0.030 Y E
20x 0.265 В±0.035 D
C 2.15 В±0.030 B
A
(4X) 0.10
TOP VIEW 0.275
1 PIN 1
(A1 CORNER) 2 3 4 0.200
0.270
BOTTOM VIEW Z
0.05 Z
0.240 PACKAGE OUTLINE SEATING PLANE
3 0.040 (BSC)
(BACKSIDE COATING) 0.400
0.290
2
0.265 В±0.035 x20
0.10
0.05 Z X Y
Z 4 0.200 В±0.030 6 NSMD …