Package Intersil W4x4.16F — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x4.16F
16 BALL WLCSP WITH 0.4mm PITCH (BSC) 4x4 ARRAY (1.740mm x 1.740mm)
Rev 0, 1/14 X 0.400 1.740В±0.030 Y D
1.740В±0.030 16x 0.265В±0.035 C
B
A (4X) 0.270 0.10
1
0.200 2 3 4
0.270 PIN 1 (A1 CORNER
TOP VIEW BOTTOM VIEW Z PACKAGE OUTLINE 0.05 Z SEATING PLANE
3 0.040 BSC
(BACK SIDE COATING) 0.240 0.290
0.400
0.265В±0.035
0.10
0.05 ZXY
Z 0.200В±0.030 TYPICAL RECOMMENDED LAND PATTERN
0.540В±0.050
SIDE VIEW NOTES:
1. Dimension and tolerance per ASMEY14.5M -1994. 2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z . 1 3. Primary datum Z and seating plane are defined by the spherical
crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. There shall be a minimum clearance of 0.10mm between …