Package Intersil W4x3.10A — Datenblatt

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W4x3.10A
4X3 ARRAY 10 BALL WAFER LEVEL CHIP SCALE PACKAGE E PIN 1 ID SYMBOL MILLIMETERS NOTES A 0.64 +0.05 -0.10 -A1 0.29 В±0.02 -D TOP VIEW bb A2 A
A1
b A2 0.35 REF. -b Оё 0.37 В±0.03 -bb Оё 0.30 REF. -D 1.50 В±0.05 -D1 1.00 BASIC -E 2.00 В±0.05 -E1 1.50 BASIC -e 0.50 BASIC -SD 0.00 BASIC -SE 0.25 BASIC -N 10 3
Rev. 1 10/05 SIDE VIEW NOTES:
1. Dimensions are in Millimeters.
2. Dimensioning and tolerancing conform to ASME 14.5M-1994. E1 3. Symbol “N” is the actual number of solder balls.
e SE
C
B SD A
1 3 2 BOTTOM VIEW 1 4 b D1 …