Package Intersil W3x3.9B — Datenblatt

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W3x3.9B
3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
(Intersil Standard) E SYMBOL MILLIMETERS NOTES A 0.54 Min, 0.65 Max -PIN A1 ID AREA
D TOP VIEW bb A2 A
A1
b A1 0.24 В±0.03 -A2 0.355 В±0.03 -b 0.32 В±0.03 -bb Оё 0.30 REF. -D 1.45 В±0.05 -D1 1.00 BASIC -E 1.45 В±0.05 -E1 1.00 BASIC -e 0.50 BASIC -SD 0.00 BASIC -N 9 3
Rev. 0 6/06 SIDE VIEW NOTES:
1. Dimensions are in Millimeters. E1 2. Dimensioning and tolerancing conform to ASME 14.5M-1994.
3. Symbol “N” is the actual number of solder balls. C 4. Reference JEDEC MO-211-C, variation DD.
SD D1 B
A
1 2 3 BOTTOM VIEW 1 b …