Package Intersil W3x2.6C — Datenblatt

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE E D
PIN 1 ID
TOP VIEW A2
A
A1 SYMBOL MILLIMETERS A 0.51 Min, 0.55 Max A1 0.225 В±0.015 A2 0.305 В±0.013 b О¦0.323 В±0.025 D 0.955 В±0.020 D1 0.50 BASIC E 1.455 В±0.020 E1 1.00 BASIC e 0.50 BASIC SD 0.25 BASIC SE 0.00 BASIC
Rev. 3 03/08 b NOTES:
SIDE VIEW 1. All dimensions are in millimeters. E1
e
SE D1 2 SD 1
b C B A BOTTOM VIEW 1 …