Datasheet GD32E103xx (GigaDevice)

GigaDevice Semiconductor Inc. GD32E103xx Arm® Cortex®-M4 32-bit MCU
Datasheet Revision 1.15 ( Dec. 2024 ) Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E103Vx LQFP100 pin definitions 2.6.2. GD32E103Rx LQFP64 pin definitions 2.6.3. GD32E103Cx LQFP48 pin definitions 2.6.4. GD32E103Tx QFN36 pin definitions 3. Functional description 3.1. Arm® Cortex®-M4 core 3.2. On-chip memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal serial bus full-speed interface (USBFS) 3.17. External memory controller (EXMC) 3.18. Debug mode 3.19. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. ADC characteristics 4.14. Temperature sensor characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. USBFS characteristics 4.21. EXMC characteristics 4.22. TIMER characteristics 4.23. WDGT characteristics 4.24. Parameter conditions 5. Package information 5.1. LQFP100 package outline dimensions 5.2. LQFP64 package outline dimensions 5.3. LQFP48 package outline dimensions 5.4. QFN36 package outline dimensions 5.5. Thermal characteristics 6. Ordering information 7. Revision history