Datasheet GD32E103xx (GigaDevice) - 5

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List of Figures Figure 2-1.GD32E103xx block diagram ... 9 Figure 2-2. GD32E103Vx LQFP100 pinouts .. 10 Figure 2-3. GD32E103Rx LQFP64 pinouts ... 11 Figure 2-4. GD32E103Cx LQFP48 pinouts ... 11 Figure 2-5. GD32E103Tx QFN36 pinouts ... 12 Figure 2-6. GD32E103xx clock tree .. 16 Figure 4-1. Recommended power supply decoupling capacitors(1)(2) .. 42 Figure 4-2. Typical supply current consumption in Run mode .. 48 Figure 4-3. Typical supply current consumption in Sleep mode .. 49 Figure 4-4. Recommended external NRST pin circuit.. 58 Figure 4-5. I/O port AC characteristics definition ... 59 Figure 4-6. I2C bus timing diagram.. 64 Figure 4-7. SPI timing diagram - master mode ... 65 Figure 4-8. SPI timing diagram - slave mode .. 65 Figure 4-9. I2S timing diagram - master mode ... 66 Figure 4-10. I2S timing diagram - slave mode .. 67 Figure 4-11. USBFS timings: definition of data signal rise and fall time ... 68 Figure 5-1. LQFP100 package outline ... 74 Figure 5-2. LQFP100 recommended footprint .. 75 Figure 5-3. LQFP64 package outline ... 76 Figure 5-4. LQFP64 recommended footprint .. 77 Figure 5-5. LQFP48 package outline ... 78 Figure 5-6. LQFP48 recommended footprint .. 79 Figure 5-7. QFN36 package outline ... 80 Figure 5-8. QFN36 recommended footprint .. 81
4 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E103Vx LQFP100 pin definitions 2.6.2. GD32E103Rx LQFP64 pin definitions 2.6.3. GD32E103Cx LQFP48 pin definitions 2.6.4. GD32E103Tx QFN36 pin definitions 3. Functional description 3.1. Arm® Cortex®-M4 core 3.2. On-chip memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal serial bus full-speed interface (USBFS) 3.17. External memory controller (EXMC) 3.18. Debug mode 3.19. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. ADC characteristics 4.14. Temperature sensor characteristics 4.15. DAC characteristics 4.16. I2C characteristics 4.17. SPI characteristics 4.18. I2S characteristics 4.19. USART characteristics 4.20. USBFS characteristics 4.21. EXMC characteristics 4.22. TIMER characteristics 4.23. WDGT characteristics 4.24. Parameter conditions 5. Package information 5.1. LQFP100 package outline dimensions 5.2. LQFP64 package outline dimensions 5.3. LQFP48 package outline dimensions 5.4. QFN36 package outline dimensions 5.5. Thermal characteristics 6. Ordering information 7. Revision history