Datasheet HT75Rxx-7 (Holtek) - 10

HT75Rxx-7 30V, 150mA TinyPowerTM LDO with Protections Application Information
When using this series of regulators, it is important that the following application points are noted if correct operation is to be achieved.
External Circuit
It is important that external capacitors are connected to both the input and output pins. For the input pin, suitable bypass capacitors as shown in the application circuits should be connected, especially in situations where a battery power source is used which may have a higher impedance. For the output pin, a suitable capacitor should also be connected especially in situations where the load has a transient nature, in which case larger capacitor values should be selected to limit any output transient voltages.
OCP and OTP Protections
The series of devices implements the over current protection and over junction temperature protection to prevent device damage even if the output is shorted to ground. When the output is shorted to ground, the output current will be clamped to ISHORT and the junction temperature will rise. Once the junction temperature exceeds 150°C, the series of devices will shut down the power element to prevent thermal damage. The protection will be released when the junction temperature falls to 125°C.
Fast Output Discharging Function
When the CE input is low, the output voltage will be fast discharged to 0V via an internal 300Ω resistor. This discharging path does not appear with protections such as over current protection or over temperature protection.
Input Capacitor CIN Considerations
It is recommended that the input capacitor is at least 1μF and is ceramic type for better temperature coefficient and lower ESR (Equivalent Series Resistance).
Output Capacitor COUT Considerations
The output capacitance plays an important role in keeping the output voltage stable. For the ceramic type capacitor, the capacitance should be at least 1.0μF. For E-cap type capacitor, the capacitance should be at least 2.2μF.
Thermal Considerations
The maximum power dissipation depends on the thermal resistance of the package, the PCB layout, the rate of the surrounding airflow and the difference between the junction and ambient temperature. The maximum power dissipation can be calculated using the following formula: PD(MAX) = (TJ(MAX) - Ta)/θJA Where TJ(MAX) is the maximum junction temperature, Ta is the ambient temperature and θJA is the junction-to-ambient thermal resistance of the device package in degrees per watt. The following table shows the θJA values for various package types.
Package Type θJA (°C/W)
SOT89 200°C/W SOT23-5 500°C/W For maximum operating rating conditions, the maximum junction temperature is 150°C. However, it is recommended that the maximum junction temperature does not exceed 125°C during normal Rev. 1.00 10 May 13, 2025 Document Outline Features Applications General Description Selection Table Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings Recommended Operating Range Electrical Characteristics Typical Performance Characteristics Application Circuits Basic Circuit High Output Current Positive Voltage Regulator Circuit for Increasing Output Voltage Constant Current Regulator Dual Supply Circuit Application Information External Circuit OCP and OTP Protections Fast Output Discharging Function Input Capacitor CIN Considerations Output Capacitor COUT Considerations Thermal Considerations Power Dissipation Calculation Package Information 3-pin SOT89 Outline Dimensions 5-pin SOT23 Outline Dimensions