Datasheet OPA4388 (Texas Instruments) - 6

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OPA388, OP A2388, OP A4388
SBOS777D – NOVEMBER 2016 – REVISED JULY 2020
www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Single-supply 6 Supply voltage VS = (V+) – (V–) V Dual-supply ±3 Common-mode (V–) – 0.5 (V+) + 0.5 Voltage V Signal input pins Differential (V+) – (V–) + 0.2 Current ±10 mA Output short circuit(2) Continuous Continuous Operating, TA –55 150 Temperature Junction, TJ 150 °C Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Short-circuit to ground, one amplifier per package.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Single-supply 2.5 5.5 Supply voltage, VS = (V+) – (V–) V Dual-supply ±1.25 ±2.75 Specified temperature –40 125 °C
6.4 Thermal Information: OPA388 OPA388 THERMAL METRIC
(1)
D (SOIC) DBV (SOT-23) DGK (VSSOP) UNIT 8 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 116 145.7 177 °C/W RθJC(top) Junction-to-case (top) thermal resistance 60 94.8 69 °C/W RθJB Junction-to-board thermal resistance 56 43.4 100 °C/W ΨJT Junction-to-top characterization parameter 12.8 24.7 9.9 °C/W ΨJB Junction-to-board characterization parameter 55.9 43.1 98.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: OPA388 OPA2388 OPA4388 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA388 6.5 Thermal Information: OPA2388 6.6 Thermal Information: OPA4388 6.7 Electrical Characteristics: VS = ±1.25 V to ±2.75 V (VS = 2.5 to 5.5 V) 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Operating Voltage 7.3.2 Input Voltage and Zero-Crossover Functionality 7.3.3 Input Differential Voltage 7.3.4 Internal Offset Correction 7.3.5 EMI Susceptibility and Input Filtering 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Bidirectional Current-Sensing 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.2.2 Single Operational Amplifier Bridge Amplifier 8.2.3 Precision, Low-Noise, DAC Buffer 8.2.4 Load Cell Measurement 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ Simulation Software (Free Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Receiving Notification of Documentation Updates 11.5 Support Resources 11.6 Trademarks 11.7 Electrostatic Discharge Caution 11.8 Glossary 12 Mechanical, Packaging, and Orderable Information