Datasheet OPA4388 (Texas Instruments) - 7
Hersteller | Texas Instruments |
Beschreibung | Quad, 10-MHz, CMOS, zero-drift, zero-crossover, true RRIO precision operational amplifier |
Seiten / Seite | 50 / 7 — OPA388. , OPA2388. , OPA4388. www.ti.com. 6.5 Thermal Information: … |
Dateiformat / Größe | PDF / 3.3 Mb |
Dokumentensprache | Englisch |
OPA388. , OPA2388. , OPA4388. www.ti.com. 6.5 Thermal Information: OPA2388. OPA2388. THERMAL METRIC. D (SOIC). DGK (VSSOP). UNIT. 8 PINS

Modelllinie für dieses Datenblatt
Textversion des Dokuments
link to page 7 link to page 7
OPA388 , OPA2388 , OPA4388 www.ti.com
SBOS777D – NOVEMBER 2016 – REVISED JULY 2020
6.5 Thermal Information: OPA2388 OPA2388 THERMAL METRIC
(1)
D (SOIC) DGK (VSSOP) UNIT 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 120.0 165 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.3 53 °C/W RθJB Junction-to-board thermal resistance 65.6 87 °C/W ΨJT Junction-to-top characterization parameter 9.6 4.9 °C/W ΨJB Junction-to-board characterization parameter 64.4 85 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.6 Thermal Information: OPA4388 OPA4388 THERMAL METRIC
(1)
D (SOIC) PW (TSSOP) UNIT 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86.4 109.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 46.3 27.4 °C/W RθJB Junction-to-board thermal resistance 41.0 56.1 °C/W ΨJT Junction-to-top characterization parameter 11.3 1.5 °C/W ΨJB Junction-to-board characterization parameter 40.7 54.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.7 Electrical Characteristics: VS = ±1.25 V to ±2.75 V (VS = 2.5 to 5.5 V)
at TA = 25°C, VCM = VOUT = VS / 2, and RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OFFSET VOLTAGE
OPA388, OPA2388 ±0.25 ±5 VS = 5.5 V OPA4388 ±2.25 ±8 VOS Input offset voltage µV TA = –40°C to +125°C OPA388, OPA2388 ±7.5 TA = –40°C to +125°C, VS = 5.5 V OPA4388 ±10.5 TA = –40°C to +125°C OPA388, OPA2388 ±0.005 ±0.05 dVOS/dT Input offset voltage drift µV/°C TA = –40°C to +125°C, VS = 5.5 V OPA4388 ±0.005 ±0.05 Power-supply rejection OPA388, OPA2388 ±0.1 ±1 PSRR T µV/V ratio A = –40°C to +125°C OPA4388 ±1.25 ±3.5 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: OPA388 OPA2388 OPA4388 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA388 6.5 Thermal Information: OPA2388 6.6 Thermal Information: OPA4388 6.7 Electrical Characteristics: VS = ±1.25 V to ±2.75 V (VS = 2.5 to 5.5 V) 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Operating Voltage 7.3.2 Input Voltage and Zero-Crossover Functionality 7.3.3 Input Differential Voltage 7.3.4 Internal Offset Correction 7.3.5 EMI Susceptibility and Input Filtering 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Bidirectional Current-Sensing 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.2.2 Single Operational Amplifier Bridge Amplifier 8.2.3 Precision, Low-Noise, DAC Buffer 8.2.4 Load Cell Measurement 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ Simulation Software (Free Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Receiving Notification of Documentation Updates 11.5 Support Resources 11.6 Trademarks 11.7 Electrostatic Discharge Caution 11.8 Glossary 12 Mechanical, Packaging, and Orderable Information