Datasheet LUXEON IR Domed (Lumileds) - 16

Reflow Soldering Guidelines
t T p p Critical Zone Ramp-up T to T L p TL t L Tsmax Temperature Tsmin Ramp-down ts Preheat Area 25 Time 25ºC to Peak JEDEC J-STD-020D Time
Figure 10. Visualization of the acceptable reflow temperature profile as specified in Table 8. Table 8. Reflow profile characteristics for LUXEON IR Domed Line. PrOfILe featUre Lead-free assemBLy
Preheat Minimum Temperature (T ) 150°C smin Preheat Maximum Temperature (T ) 200°C smax Preheat Time (t to t ) 120 seconds smin smax Ramp-Up Rate (T to T ) 3°C / second maximum L p Liquidous Temperature (T ) 217°C L Time Maintained Above Temperature T (t ) 150 seconds L L Peak / Classification Temperature (T ) 260°C p Time Within 5°C of Actual Peak Temperature (t ) 10 to 30 seconds p Ramp-Down Rate (T to T ) 6°C / second maximum p L Time 25°C to Peak Temperature 8 minutes maximum JEDEC Moisture Sensitivity
Table 9 . Moisture sensitivity levels for LUXEON IR Domed Line . fLOOr LIfe sOak reqUIrements standard LeVeL tIme cOndItIOns tIme cOndItIOns
1 Unlimited ≤30°C / 85% RH 168 Hours +5 / -0 85°C / 85% RH DS191 LUXEON IR Domed Line Product Datasheet 20200403 ©2020 Lumileds Holding B.V. All rights reserved. 15 Document Outline General Product Information Product Test Conditions Part Number Nomenclature Radiometric Power Maintenance Environmental Compliance Performance Characteristics Product Selection Guide Optical Characteristics Electrical and Thermal Characteristics Absolute Maximum Ratings Characteristic Curves Spectral Power Distribution Characteristics Light Output Characteristics Forward Current Characteristics Wavelength Shift Characteristics Radiation Pattern Characteristics Permissible Pulse Handling Characteristics Product Bin and Labeling Definitions Decoding Product Bin Labeling Radiometric Power Bins Peak Wavelength Bins Forward Voltage Bins Mechanical Dimensions Reflow Soldering Guidelines JEDEC Moisture Sensitivity Solder Pad Design Packaging Information Pocket Tape Dimensions Reel Dimensions