Datasheet RX74M (Renesas) - 5

RX74M Group 1. Overview
Table 1.1 Outline of Specifications (4/10) Classification Module/Function Description
Interrupt Interrupt controller Number of interrupt vectors: 256 (ICUM) External interrupts: 32 (pins IRQ0 to IRQ31) Software interrupts: 2 sources Non-maskable interrupts: 13 sources 32 levels specifiable for the order of priority Method of interrupt source selection: The interrupt vectors consist of 256 vectors (128 sources are fixed. The remaining 128 vectors are selected from among the other 374 sources.) External bus extension The external address space can be divided into eight areas (CS0 to CS7), each with independent control of access settings. Capacity of each area: 16 Mbytes (CS0 to CS7) A chip-select signal (CS0# to CS7#) can be output for each area. Each area is specifiable as an 8-, 16-, or 32-bit bus space. The data arrangement in each area is selectable as little or big endian (only for data). SDRAM interface connectable Bus format: Separate bus, multiplex bus Wait control Write buffer facility Connection for a memory device compliant with the expanded serial peripheral interface (xSPI) is possible (JEDEC Standards JESD 251, JESD 251-1, and JESD 252). DMA DMA controller 8 channels (DMACAa) Four transfer modes: Normal transfer, repeat transfer, block transfer, and repeat block transfer Request sources: Software trigger and interrupt requests from peripheral functions EXDMA controller 2 channels (EXDMACAa) Four transfer modes: Normal transfer, repeat transfer, block transfer, and repeat block transfer Request sources: Software trigger, external interrupts, and interrupt requests from peripheral functions Data transfer controller Three transfer modes: Normal transfer, repeat transfer, and block transfer (DTCA) Request sources: External interrupts and interrupt requests from peripheral functions Sequence transfer I/O ports Programmable I/O ports I/O ports for the 320-pin LFBGA I/O pins: 197 Input pins: 3 Pull-up resistors: 198 Open-drain outputs: 197 5-V tolerant pins: 16 I/O ports for the 224-pin LFBGA I/O pins: 159 Input pins: 3 Pull-up resistors: 160 Open-drain outputs: 159 5-V tolerant pins: 16 I/O ports for the 176-pin LFBGA and 176-pin LFQFP I/O pins: 120 Input pins: 3 Pull-up resistors: 121 Open-drain outputs: 120 5-V tolerant pins: 16 I/O ports for the 144-pin LFQFP I/O pins: 100 Input pins: 3 Pull-up resistors: 101 Open-drain outputs: 100 5-V tolerant pins: 16 I/O ports for the 100-pin LFQFP I/O pins: 72 Input pins: 3 Pull-up resistors: 73 Open-drain outputs: 72 5-V tolerant pins: 9 R01DS0433EJ0110 Rev.1.10 Page 5 of 299 Jul 31, 2026 Document Outline Features 1. Overview 1.1 Outline of Specifications 1.2 List of Products 1.3 Block Diagram 1.4 Pin Functions 1.5 Pin Assignments 1.5.1 320-Pin LFBGA 1.5.2 224-Pin LFBGA 1.5.3 176-Pin LFBGA 1.5.4 176-Pin LFQFP 1.5.5 144-Pin LFQFP 1.5.6 100-Pin LFQFP 1.6 List of Pin and Pin Functions 1.6.1 320-Pin LFBGA 1.6.2 224-Pin LFBGA 1.6.3 176-Pin LFBGA 1.6.4 176-Pin LFQFP 1.6.5 144-Pin LFQFP 1.6.6 100-Pin LFQFP 2. Electrical Characteristics 2.1 Test Conditions 2.1.1 Maximum and Minimum Values (Max./Min.) 2.1.2 Typical Values (Typ.) 2.2 Absolute Maximum Ratings 2.3 Recommended Operating Conditions 2.4 DC Characteristics 2.4.1 Characteristics of the Input Voltage of the I/O Pins 2.4.2 Characteristics of the Output Voltage of the I/O Pins 2.4.3 Characteristics of the Other I/O Pins 2.4.4 Operating and Standby Currents 2.4.4.1 Operating and Standby Currents for Product Part No. R5K574Mxy4xx (y = A, B, C, D, T, U, V, W) 2.4.4.2 Operating and Standby Currents for Product Part No. R5K574Mxy4xx (y = E, F) 2.4.4.3 Currents in Deep Software Standby Mode 2.4.4.4 Other Operating Currents 2.4.4.5 Permissible Output Currents 2.4.5 Thermal Characteristics 2.4.5.1 Thermal Resistance Value 2.4.5.2 Supply Currents for the Peripheral Functions 2.4.5.3 Example of Calculation of Ta 2.4.6 VCC Rising and Falling Slopes and Ripple Frequency 2.5 AC Characteristics 2.5.1 Operating Frequency 2.5.2 Clock Timing 2.5.3 Reset Timing 2.5.4 Timing of Return from Low Power Consumption Modes 2.5.5 Control Signal Timing 2.5.6 Bus Timing 2.5.7 Timing of On-Chip Peripheral Modules 2.5.7.1 I/O Port 2.5.7.2 TMR 2.5.7.3 CMTW 2.5.7.4 POEG 2.5.7.5 GPTW 2.5.7.6 RSCI 2.5.7.7 RSPIA 2.5.7.8 XSPI 2.5.7.9 RIICHS 2.5.7.10 RI3C 2.5.7.11 SSIE 2.5.7.12 SD/MMC Host Interface 2.5.7.13 PDC 2.5.7.14 HRPWM 2.5.7.15 CANFD/CANFDG 2.5.7.16 ESC 2.5.7.17 ESWM 2.5.7.18 PDMIF 2.5.7.19 Δ-Σ Interface 2.5.7.20 PCIF 2.5.7.21 PIO 2.5.7.22 A/D Converter Trigger 2.5.7.23 CAC 2.6 USB Characteristics 2.6.1 USB Timing 2.6.2 USBHS Timing 2.7 A/D Conversion Characteristics 2.7.1 Analog Input Voltage Range 2.7.2 Common Characteristics of the 16-Bit A/D Converter 2.7.3 SAR Mode Characteristics 2.7.4 Common Characteristics of Oversampling Mode and Hybrid Mode 2.7.5 Oversampling Mode Characteristics 2.7.6 Hybrid Mode Characteristics 2.8 D/A Conversion Characteristics 2.9 Temperature Sensor Characteristics 2.10 Power-on Reset Circuit and Voltage Detection Circuit Characteristics 2.11 Core Voltage Monitoring Reset Characteristics 2.12 Oscillation Stop Detection Timing 2.13 External VDD Timing Characteristics 2.14 Battery Backup Function Characteristics 2.15 MRAM Characteristics 2.15.1 Code MRAM Characteristics 2.15.2 Option-Setting Memory (MRAM Area) Characteristics 2.15.3 Option-Setting Memory (OTP Area with ECC) Characteristics 2.15.4 Option-Setting Memory (OTP Area without ECC) Characteristics 2.15.5 MACI Command Characteristics 2.15.6 W-HUK Zeroization Characteristics 2.15.7 MRAM Magnetic Field Resistance Characteristics 2.15.8 Data MRAM Characteristics 2.16 Boundary Scan 2.17 Usage Note 2.17.1 Connecting VCL Capacitor and Bypass Capacitors Appendix 1. Package Dimensions REVISION HISTORY General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products Notice