CAP400DGSO-8 (D Package)0.10 (0.004)A-B 2 C2X DETAIL A 4 B 4.90 (0.193) BSC A 4 D 8 5 GAUGEPLANESEATINGPLANE 2 3.90 (0.154) BSC6.00 (0.236) BSC o C 0 - 81.04 (0.041) REF0.25 (0.010)BSC0.10 (0.004) C D0.40 (0.016)2X 1 Pin 1 ID 4 0.20 (0.008) C1.27 (0.050)2X1.27 (0.050) BSC7X 0.31 - 0.51 (0.012 - 0.020)0.25 (0.010) M C A-B D1.35 (0.053)1.25 - 1.651.75 (0.069)(0.049 - 0.065) DETAIL A 0.10 (0.004)0.10 (0.004) C H 0.25 (0.010)7XSEATING PLANE C 0.17 (0.007) 0.25 (0.010)ReferenceSolder Pad + DimensionsNotes: 1. JEDEC reference: MS-012.1.45 (0.057) 4.00 (0.157) 5.45 (0.215)2. Package outline exclusive of mold flash and metal burr. 3. Package outline inclusive of plating thickness. 4. Datums A and B to be determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions + + + are shown in parenthesis. Angles in degrees.D08A1.27 (0.050)0.60 (0.024) PI-5615-020515 5PRELIMINARY Rev. A 06/26 www.power.com