Datasheet RB521CS30L (Nexperia) - 3
| Hersteller | Nexperia |
| Beschreibung | 100 mA Low VF Schottky Barrier Rectifier in SOD882 package |
| Seiten / Seite | 10 / 3 — Nexperia. RB521CS30L. 100 mA low VF Schottky barrier rectifier. 9. … |
| Dateiformat / Größe | PDF / 236 Kb |
| Dokumentensprache | Englisch |
Nexperia. RB521CS30L. 100 mA low VF Schottky barrier rectifier. 9. Thermal characteristics Table 6. Thermal characteristics
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Nexperia RB521CS30L 100 mA low VF Schottky barrier rectifier 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air [1] [2] - - 395 K/W junction to ambient [3] [1] [2] - - 220 K/W [4] Rth(j-sp) thermal resistance from [5] - - 70 K/W junction to solder point [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [5] Soldering point of cathode tab. 006aac500 103 duty cycle = Zth(j-a) 1 (K/W) 0.75 0.5 102 0.33 0.25 0.2 0.1 0.05 10 0.02 0 0.01 110-5 10- 3 10- 2 10- 4 10 102 10- 1 103 1 tp (s) FR4 PCB, standard footprint
Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac501 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 0 0.01 110-5 10- 3 10- 2 10- 4 10 102 10- 1 103 1 tp (s) FR4 PCB, mounting pad for cathode 1 cm2
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
RB521CS30L All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2025. Al rights reserved Submit document feedback
Product data sheet 2 October 2025 3 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
Nexperia RB521CS30L 100 mA low VF Schottky barrier rectifier 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air [1] [2] - - 395 K/W junction to ambient [3] [1] [2] - - 220 K/W [4] Rth(j-sp) thermal resistance from [5] - - 70 K/W junction to solder point [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [5] Soldering point of cathode tab. 006aac500 103 duty cycle = Zth(j-a) 1 (K/W) 0.75 0.5 102 0.33 0.25 0.2 0.1 0.05 10 0.02 0 0.01 110-5 10- 3 10- 2 10- 4 10 102 10- 1 103 1 tp (s) FR4 PCB, standard footprint
Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aac501 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 0 0.01 110-5 10- 3 10- 2 10- 4 10 102 10- 1 103 1 tp (s) FR4 PCB, mounting pad for cathode 1 cm2
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
RB521CS30L All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2025. Al rights reserved Submit document feedback
Product data sheet 2 October 2025 3 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents