Datasheet RB521CS30L (Nexperia) - 2
| Hersteller | Nexperia |
| Beschreibung | 100 mA Low VF Schottky Barrier Rectifier in SOD882 package |
| Seiten / Seite | 10 / 2 — Nexperia. RB521CS30L. 100 mA low VF Schottky barrier rectifier. 5. … |
| Dateiformat / Größe | PDF / 236 Kb |
| Dokumentensprache | Englisch |
Nexperia. RB521CS30L. 100 mA low VF Schottky barrier rectifier. 5. Pinning information Table 2. Pinning information. Pin. Symbol
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Nexperia RB521CS30L 100 mA low VF Schottky barrier rectifier 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol
1 K cathode[1] 2 A anode 1 2 K A Transparent aaa-003679 top view
DFN1006-2 (SOD882)
[1] The marking bar indicates the cathode.
6. Ordering information Table 3. Ordering information Type number Package Name Description Version
RB521CS30L DFN1006-2 plastic, leadless ultra small package; 2 terminals; 0.65 mm SOD882 pitch; 1 mm x 0.6 mm x 0.48 mm body
7. Marking Table 4. Marking codes Type number Marking code
RB521CS30L AR
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage Tj = 25 °C - 30 V IF(AV) average forward current δ = 0.5; f = 20 kHz; square wave; Tamb ≤ [1] - 100 mA 135 °C δ = 0.5; f = 20 kHz; square wave; Tsp ≤ - 100 mA 145 °C IFSM non-repetitive peak tp ≤ 8.3 ms; half sine wave [2] - 3 A forward current Ptot total power dissipation Tamb ≤ 25 °C [3] [4] - 315 mW [1] [4] - 565 mW Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [2] Tj = 25 °C prior to surge. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [4] Reflow soldering is the only recommended soldering method. RB521CS30L All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2025. Al rights reserved Submit document feedback
Product data sheet 2 October 2025 2 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
Nexperia RB521CS30L 100 mA low VF Schottky barrier rectifier 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol
1 K cathode[1] 2 A anode 1 2 K A Transparent aaa-003679 top view
DFN1006-2 (SOD882)
[1] The marking bar indicates the cathode.
6. Ordering information Table 3. Ordering information Type number Package Name Description Version
RB521CS30L DFN1006-2 plastic, leadless ultra small package; 2 terminals; 0.65 mm SOD882 pitch; 1 mm x 0.6 mm x 0.48 mm body
7. Marking Table 4. Marking codes Type number Marking code
RB521CS30L AR
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage Tj = 25 °C - 30 V IF(AV) average forward current δ = 0.5; f = 20 kHz; square wave; Tamb ≤ [1] - 100 mA 135 °C δ = 0.5; f = 20 kHz; square wave; Tsp ≤ - 100 mA 145 °C IFSM non-repetitive peak tp ≤ 8.3 ms; half sine wave [2] - 3 A forward current Ptot total power dissipation Tamb ≤ 25 °C [3] [4] - 315 mW [1] [4] - 565 mW Tj junction temperature - 150 °C Tamb ambient temperature -65 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [2] Tj = 25 °C prior to surge. [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [4] Reflow soldering is the only recommended soldering method. RB521CS30L All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2025. Al rights reserved Submit document feedback
Product data sheet 2 October 2025 2 / 10
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents