Datasheet TB67S531FTG (Toshiba) - 2

TB67S531FTG
3. Block Diagram PHASE_A IN_A1 Motor OSCM OSC-Clock IN_A2 Oscillator Converter PHASE_B VCC System Regulator IN_B1 Oscillator IN_B2 VM Power-on Signal DECAY1 Reset Decode DECAY2 Logic VREFA TRQ Current Current Reference SLEEP_X Level VREFB Setting Set LO1 LO2 Charge pump Motor Control Logic Current Current Comp Comp Predriver TSD Predriver ISD AGND PGND RSGND_A RSGND_B OUTA1 OUTB1 OUTA2 OUTB2 Figure 3.1 Block Diagram
Note: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. ©2026 2 2026-04-07 Toshiba Electronic Devices & Storage Corporation Rev. 1.0.A Document Outline 1. Description 2. Features 3. Block Diagram 4. Pin Assignments 5. Pin Description 5.1. Pin Function Description TB67S531FTG 5.2. Input and Output Equivalent Circuit 6. Functional Description: TB67S531FTG 6.1. SLEEP_X function 6.2. Phase input control mode 6.2.1. Functions of IN_A1, IN_A2, IN_B1, IN_B2, PHASE_A, PHASE_B 6.2.2. Sequence by each drive mode in phase input control mode 6.2.2.1. Full-step resolution 6.2.2.2. Half-step resolution 6.2.2.3. Quarter-step resolution 6.3. Torque function 6.4. Selectable Mixed Decay Function 6.4.1. Mixed Decay Waveform (Current Waveform) 6.4.2. Each Time of Constant Current PWM Operation 6.4.3. Mixed Decay Current Waveform 6.4.3.1. When the set current value is increased 6.4.3.2. When the Charge period is more than 1 fCHOP cycle 6.4.3.3. When the set current value is decreased 6.5. ADMD (Advanced Dynamic Mixed Decay) Constant Current Control 6.6. ADMD Current Waveform 6.6.1. When the next current value is increased 6.6.2. When Charge period ≥ 1 fCHOP cycle 6.6.3. When the next current value is decreased 6.6.4. Fast period > 1 fCHOP cycle (The motor current does not reach the ADMD threshold during 1 fCHOP cycle.) 6.7. LO (Error detection flag output) function 6.8. Output Transistor Function mode (Advanced Dynamic Mixed Decay) 6.9. Set current value (IOUT) 6.10. Chopping frequency (fCHOP) 6.11. Power consumption of the IC 6.11.1. Power consumption of the power transistor 6.11.2. Power consumption of logic and IM systems 6.11.3. Power consumption 6.12. Detection Function 6.12.1. Thermal shutdown detection (This function is a latch type that maintains the operation at the time of detection.) 6.12.1.1. When over temperature is detected: 6.12.2. Over-current detection (This function is a latch type that maintains the operation at the time of detection.) 6.12.2.1. When over-current is detected in the lower DMOS of H-bridge by the short-circuiting to the power supply 6.12.2.2. When over-current is detected in the upper DMOS of H-bridge by the short-circuiting to the ground: 7. Absolute Maximum Ratings (Ta = 25 C) 8. Operating Ranges (Ta = -40 to 85 C) 9. Electrical Characteristics 9.1. Electrical Characteristics 1 (Ta = 25 C, VM = 24 V, unless otherwise specified) 9.2. Electrical Characteristics 2 (Ta = 25 C, VM = 24 V, unless otherwise specified) 9.3. AC Electrical Characteristics (Ta = 25 C, VM = 24 V) 9.3.1. AC Electrical Characteristics Timing Chart 10. Application Circuit Example 11. Package Information 11.1. Package Dimensions 12. IC Usage Considerations 12.1. Notes on Handling of ICs 12.2. Points to Remember on Handling of Ics RESTRICTIONS ON PRODUCT USE