Datasheet CLF24H4LS300P (Ampleon) - 2
| Hersteller | Ampleon |
| Beschreibung | RF power GaN-SiC HEMT |
| Seiten / Seite | 11 / 2 — CLF24H4LS300P. RF power GaN-SiC HEMT. 2. Pinning. information. Table 2. … |
| Dateiformat / Größe | PDF / 1.2 Mb |
| Dokumentensprache | Englisch |
CLF24H4LS300P. RF power GaN-SiC HEMT. 2. Pinning. information. Table 2. Pinning. Pin. Description. Simplified outline. Graphic symbol
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CLF24H4LS300P RF power GaN-SiC HEMT 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol
1 drain1 1 2 drain2 1 2 3 gate1 3 4 gate2 3 4 5 5 4 5 source [1] 2 amp02028 [1] Connected to flange.
3. Ordering information Table 3. Ordering information Package name Orderable part number 12NC Packing description Min. orderable quantity (pieces)
SOT1214B CLF24H4LS300PU 9349 607 62112 Tray; 20-fold; non-dry pack 60 CLF24H4LS300PJ 9349 607 62118 TR13; 100-fold; 44 mm; non-dry pack 100
4. Limiting values Table 4. Limiting values Symbol Parameter Conditions Min Max Unit
VDD source voltage operating - 52 V VDS drain-source voltage - 150 V VGS gate-source voltage 15 +2 V IGF forward gate current - 43.2 mA Tstg storage temperature 65 +150 C Tch active die channel temperature - 225 C
5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(s-c)(IR) [1] thermal resistance from active die surface DC; VDS = 50 V; 0.40 K/W to case by Infrared measurement ID = 2.6 A; Pdis = 130 W; Tcase = 50 C Rth(ch-c)(FEA) [2] thermal resistance from active die channel Pdis = 134 W; 0.58 K/W to case by Finite Element Analysis Tcase = 72 C [1] Infrared (IR) thermal values are for reference only and cannot be used to determine performance or reliability. [2] Finite Element Analysis (FEA) thermal values have been used for the online MTF calculator. CLF24H4LS300P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2024. All rights reserved.
Product data sheet Rev. 1 — 30 July 2024 2 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 7.1 Test circuit 7.2 Graphical data 7.3 Impedance information 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
CLF24H4LS300P RF power GaN-SiC HEMT 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol
1 drain1 1 2 drain2 1 2 3 gate1 3 4 gate2 3 4 5 5 4 5 source [1] 2 amp02028 [1] Connected to flange.
3. Ordering information Table 3. Ordering information Package name Orderable part number 12NC Packing description Min. orderable quantity (pieces)
SOT1214B CLF24H4LS300PU 9349 607 62112 Tray; 20-fold; non-dry pack 60 CLF24H4LS300PJ 9349 607 62118 TR13; 100-fold; 44 mm; non-dry pack 100
4. Limiting values Table 4. Limiting values Symbol Parameter Conditions Min Max Unit
VDD source voltage operating - 52 V VDS drain-source voltage - 150 V VGS gate-source voltage 15 +2 V IGF forward gate current - 43.2 mA Tstg storage temperature 65 +150 C Tch active die channel temperature - 225 C
5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(s-c)(IR) [1] thermal resistance from active die surface DC; VDS = 50 V; 0.40 K/W to case by Infrared measurement ID = 2.6 A; Pdis = 130 W; Tcase = 50 C Rth(ch-c)(FEA) [2] thermal resistance from active die channel Pdis = 134 W; 0.58 K/W to case by Finite Element Analysis Tcase = 72 C [1] Infrared (IR) thermal values are for reference only and cannot be used to determine performance or reliability. [2] Finite Element Analysis (FEA) thermal values have been used for the online MTF calculator. CLF24H4LS300P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2024. All rights reserved.
Product data sheet Rev. 1 — 30 July 2024 2 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 7.1 Test circuit 7.2 Graphical data 7.3 Impedance information 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents