Datasheet NXS0506 (Nexperia) - 10

HerstellerNexperia
BeschreibungSD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection
Seiten / Seite17 / 10 — Nexperia. NXS0506. SD 3.0-compatible memory card integrated …
Revision31012022
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DokumentenspracheEnglisch

Nexperia. NXS0506. SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

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Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection
tW VI 65 % negative V pulse M VM 35 % 0 V tf tr tr tf VI 65 % positive pulse VM VM 35 % 0 V tW VCCA VCCB VI VO G DUT CL aaa-034252 Test data is given in Table 11. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; input edges (tr, tf) are defined in Section 13. CL = Load capacitance including jig and probe capacitance.
Fig. 6. Test circuit for measuring switching time Table 11. Test data Supply voltage Input Load VCCA VCCB VI [1] CL (host side) CL (card side)
1.1 V to 1.95 V 1.7 V to 3.6 V VCCI 10 pF 15 pF [1] VCCI is the supply voltage associated with the input. NXS0506 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 1 — 31 January 2022 10 / 17
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 5. Marking 6. Block diagram 7. Functional diagram 8. Pinning information 8.1. Pinning 8.2. Pin description 9. Functional description 9.1. Level translator 9.2. Enable and direction control 9.3. Feedback clock channel 9.4. EMI filter 9.5. ESD protection 9.6. Pin and channel naming 10. Limiting values 11. Recommended operating conditions 12. Static characteristics 13. Dynamic characteristics 13.1. Level translator 14. Application information 14.1. PCB design guidelines 15. Design and assembly recommendations 15.1. PCB design guidelines 15.2. PCB assembly guidelines for Pb-free soldering 16. Package outline 17. Abbreviations 18. Revision history 19. Legal information Contents