Datasheet NXS0506 (Nexperia) - 2

HerstellerNexperia
BeschreibungSD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection
Seiten / Seite17 / 2 — Nexperia. NXS0506. SD 3.0-compatible memory card integrated …
Revision31012022
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DokumentenspracheEnglisch

Nexperia. NXS0506. SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and

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Nexperia NXS0506 SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version
NXS0506UP -40 °C to +85 °C WLCSP16 wafer level chip-scale package; 16 bumps; SOT8025-1 1.455 mm x 1.455 mm x 0.43 mm body
5. Marking Table 2. Marking codes Type number Marking code
NXS0506UP m5
6. Block diagram NXS0506
VCCA VCCB
CONTROL LOGIC
CLKA CLKB CLKFB CMDA CMDB DAT0A
L 8 kV ESD
DAT0B
O PROTECTION HOST/ EMI TR BASE 2 kV ESD N MEMORY O EMI FILTER BAND PROTECTION CARD C N
DAT1A
RESISTOR
DAT1B
TIO NETWORK EC IR -D
DAT2A
TO
DAT2B
U A
DAT3A DAT3B aaa-034247
Fig. 1. Block diagram
NXS0506 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2022. Al rights reserved
Product data sheet Rev. 1 — 31 January 2022 2 / 17
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Ordering information 5. Marking 6. Block diagram 7. Functional diagram 8. Pinning information 8.1. Pinning 8.2. Pin description 9. Functional description 9.1. Level translator 9.2. Enable and direction control 9.3. Feedback clock channel 9.4. EMI filter 9.5. ESD protection 9.6. Pin and channel naming 10. Limiting values 11. Recommended operating conditions 12. Static characteristics 13. Dynamic characteristics 13.1. Level translator 14. Application information 14.1. PCB design guidelines 15. Design and assembly recommendations 15.1. PCB design guidelines 15.2. PCB assembly guidelines for Pb-free soldering 16. Package outline 17. Abbreviations 18. Revision history 19. Legal information Contents