Datasheet EPC21603 (Efficient Power Conversion) - 2
| Hersteller | Efficient Power Conversion |
| Beschreibung | 40 V, 10 A, LVDS Logic, eToF Laser Driver IC |
| Seiten / Seite | 9 / 2 — EPC21603 – 40 V, 10 A eToF. Laser Driver IC –. PRELIMINARY. Typical … |
| Dateiformat / Größe | PDF / 838 Kb |
| Dokumentensprache | Englisch |
EPC21603 – 40 V, 10 A eToF. Laser Driver IC –. PRELIMINARY. Typical Connection Diagram. Absolute Maximum Ratings. Symbol
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EPC21603 – 40 V, 10 A eToF
Laser Driver IC – PRELIMINARY Typical Connection Diagram
Laser Driver
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to GND unless indicated otherwise.
Symbol Definition Min Max Units
VD Drain Voltage 40 V VDD Low Side Supply Voltage (VDD to GND) -0.3 5.5 V IN Logic Input -0.3 5 V ID Average Drain Current 1.7 A TJ Junction Temperature -40 150 °C TSTG Storage Temperature -40 150 °C
ESD Ratings
(Testing performed at EAG Lab. Need to get the relevant JEDEC specs for ESD ratings)
Symbol Definition Min Units
HBM Human-body model +/-1000 V CDM Charged-device model +/-500 V
Thermal Characteristics
RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.
Symbol Definition Typ Units
RθJC Thermal Resistance, Junction to Case TBD °C/W RθJB Thermal Resistance, Junction to Board TBD °C/W Subject to Change without Notice www.epc-co.com COPYRIGHT 2021 Page 2
Laser Driver IC – PRELIMINARY Typical Connection Diagram
Laser Driver
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to GND unless indicated otherwise.
Symbol Definition Min Max Units
VD Drain Voltage 40 V VDD Low Side Supply Voltage (VDD to GND) -0.3 5.5 V IN Logic Input -0.3 5 V ID Average Drain Current 1.7 A TJ Junction Temperature -40 150 °C TSTG Storage Temperature -40 150 °C
ESD Ratings
(Testing performed at EAG Lab. Need to get the relevant JEDEC specs for ESD ratings)
Symbol Definition Min Units
HBM Human-body model +/-1000 V CDM Charged-device model +/-500 V
Thermal Characteristics
RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board.
Symbol Definition Typ Units
RθJC Thermal Resistance, Junction to Case TBD °C/W RθJB Thermal Resistance, Junction to Board TBD °C/W Subject to Change without Notice www.epc-co.com COPYRIGHT 2021 Page 2