Datasheet HMC754S8GE (Analog Devices) - 6

HMC754S8GE
v01.1119
GaAs HBT HIGH LINEARITY PUSH-PULL AMPLIFIER, 75 Ohm, DC - 1 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Vdc RF Input Power (RFIN) +10 dBm ELECTROSTATIC SENSITIVE DEVICE 8 Junction Temperature 150 °C OBSERVE HANDLING PRECAUTIONS Continuous Pdiss (T = 85 °C) 1.21 W (derate 18.69 mW/°C above 85 °C) T Thermal Resistance M 53.5 °C/W (junction to ground paddle) Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C K - S ESD Sensitivity (HBM) Class 1C C
8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] (RH-8-3) Dimensions shown in millimeters
LO
Outline Drawing 3.10 2.18 3.00
IN B
1.98 2.90 1.78
A
8 5 3.10 5.05 1.52 3.00 4.90 EXPOSED PAD 1.32 2.90 4.75 1 1.12 4 FOR PROPER CONNECTION OF
R & G
THE EXPOSED PAD, REFER TO TOP VIEW BOTTOM VIEW 0.65 THE PIN CONFIGURATION AND
E
BSC 1.95 BSC FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.94
IV
0.86 1.10 SIDE VIEW 0.25 GAGE MAX PLANE 0.23
R
0.78 0.08 0.13 0.40 END VIEW 6° MAX 0.33 0.70 0° 0.95 COPLANARITY 0.25 0.55 REF 0.10 0.40
S - D R
PKG-004855 COMPLIANT TO JEDEC STANDARDS MO-187-AA-T 09-19-2016-A
IE 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP] (RH-8-3) Dimensions shown in mil imeters LIF P M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC754S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC754 XXXX HMC754S8GETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] HMC754 XXXX 124063- Eval Board HMC754S8GE 124825- Eval Board HMC754S8GE 126311- Eval Board HMC754S8GE [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Typical Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Output IP3 vs. Temperature Output IP2 vs. Temperature Noise Figure vs. Temperature P1dB vs. Temperature Reverse Isolation vs. Temperature Output IP2 vs. Output Power CSO / CTB / XMOD @ +15 dBmV input, 133 channels (Analog) Option 1 - Improved Input Return Loss & Gain Flatness (with Lower IP2) Application Gain & Return Loss Output IP2 vs. Frequency Output IP3 vs. Frequency Noise Figure vs. Frequency P1dB vs. Frequency Option 2 - 10 to 100 MHz Application Gain & Return Loss Output IP3 vs. Frequency Noise Figure vs. Frequency P1dB vs. Frequency Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Application Circuit for Push-Pull Operation Components for Selected Options Evaluation PCB Option 2 Application List of Materials Option 1 Application List of Materials