Datasheet BLF978P (Ampleon) - 7

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BLF978P HF / VHF power LDMOS transistor 8.3 Test circuit
200.3 mm C18 R3 C7 C9 90 mm B1 B3 C5 R1 C11 L1 C15 C2 5 mm 5 mm 10.5 mm C20 C1 C14 C22 C17 C4 C13 C3 C16 C21 R2 L2 B2 C6 C12 B4 R4 C8 C10 C19 amp01283 2 mm 17 mm 1.6 mm Printed-Circuit Board (PCB): Rogers RT/duroid 5880; thickness = 0.79 mm. See Table 10 for a list of components.
Fig 8. Component layout for class-AB production test circuit Table 10. List of components
For test circuit see Figure 8.
Component Description Value Remarks
C1, C7, C8, C9, C10, C22 multilayer ceramic chip capacitor 1 nF ATC 100B C2, C3 multilayer ceramic chip capacitor 62 pF ATC 100B C4 multilayer ceramic chip capacitor 111 pF ATC 100B C5, C6, C11, C12 multilayer ceramic chip capacitor 4.7 F, 100 V C3225X7S2A475K200AE C13, C14, C20, C21 multilayer ceramic chip capacitor 47 pF ATC 100B C15, C16 multilayer ceramic chip capacitor 43 pF ATC 100B C17 multilayer ceramic chip capacitor 51 pF ATC 100B C18, C19 electrolytic capacitor 1500 F, 80 V L1, L2 air core inductor 17.5 nH B06TJLB R1, R2 SMD resistor 5.1 SMD 1206 R3, R4 shunt resistor 0.01 Ohmite: FC4L110R010FER B1, B2, B3, B4 coaxial line 50 , 58 mm HUBER+SUHNER: EZ-141-AL-TP-M17 BLF978P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 3 April 2020 7 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 8. Test information 8.1 Ruggedness in class-AB operation 8.2 Impedance information 8.3 Test circuit 8.4 Graphical data 8.4.1 1-Tone CW pulsed 9. Package outline 10. Handling information 11. Abbreviations 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents