Datasheet VL53L3CX (STMicroelectronics) - 3
| Hersteller | STMicroelectronics |
| Beschreibung | Time-of-Flight ranging sensor with multi target detection |
| Seiten / Seite | 35 / 3 — VL53L3CX. Product overview. 1.1. Technical specification. Table 1. … |
| Dateiformat / Größe | PDF / 1.3 Mb |
| Dokumentensprache | Englisch |
VL53L3CX. Product overview. 1.1. Technical specification. Table 1. Technical specification. Feature. Detail. 1.2. System block diagram
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VL53L3CX Product overview 1 Product overview 1.1 Technical specification Table 1. Technical specification Feature Detail
Package Optical LGA12 Size 4.4 x 2.4 x 1 mm Operating voltage 2.6 to 3.5 V Operating temperature -20 to 85 °C Infrared emitter 940 nm Up to 1 MHz (Fast mode plus) serial bus I2C Address: 0x52
1.2 System block diagram Figure 1. VL53L3CX block diagram VL53L3CX module VL53L3CX silicon Single Photon Avalanche Diode (SPAD)
GND
Detection array
AVDD
ROM
SDA
Non Volatile
XSHUT
Memory RAM
SCL GPIO1
Microcontroller Advanced Ranging Core VCSEL Driver
AVSSVCSEL IR+ IR- AVDDVCSEL 940nm
DS13204
-
Rev 2 page 3/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents
Package Optical LGA12 Size 4.4 x 2.4 x 1 mm Operating voltage 2.6 to 3.5 V Operating temperature -20 to 85 °C Infrared emitter 940 nm Up to 1 MHz (Fast mode plus) serial bus I2C Address: 0x52
1.2 System block diagram Figure 1. VL53L3CX block diagram VL53L3CX module VL53L3CX silicon Single Photon Avalanche Diode (SPAD)
GND
Detection array
AVDD
ROM
SDA
Non Volatile
XSHUT
Memory RAM
SCL GPIO1
Microcontroller Advanced Ranging Core VCSEL Driver
AVSSVCSEL IR+ IR- AVDDVCSEL 940nm
DS13204
-
Rev 2 page 3/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents