Datasheet VL53L3CX (STMicroelectronics) - 2

HerstellerSTMicroelectronics
BeschreibungTime-of-Flight ranging sensor with multi target detection
Seiten / Seite35 / 2 — VL53L3CX. Description. DS13204. Rev 2. page 2/35
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DokumentenspracheEnglisch

VL53L3CX. Description. DS13204. Rev 2. page 2/35

VL53L3CX Description DS13204 Rev 2 page 2/35

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VL53L3CX Description
The VL53L3CX is the latest Time-of-Flight (ToF) product from STMicroelectronics and embeds ST’s third generation FlightSense patented technology. It combines a high performance proximity and ranging sensor, with multi target distance measurements and automatic smudge correction. The miniature reflowable package integrates a single photon avalanche diode (SPAD) array and physical infrared filters to achieve the best ranging performance in various ambient lighting conditions, with a wide range of cover glass windows. The VL53L3CX combines the benefits of a high-performance proximity sensor, with excellent short distance linearity, together with ranging capability up to 3 m. With patented algorithms and ingenious module construction, the VL53L3CX is also able to detect different objects within the field of view (FoV) with depth understanding. The ST histogram algorithms allow cover glass crosstalk immunity beyond 80 cm, and dynamic smudge compensation.
DS13204
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Rev 2 page 2/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents