Package Intersil M28.173 — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A
9.70В± 0.10 1 3
SEE DETAIL "X"
15 28 6.40
PIN #1
I.D. MARK 4.40 В± 0.10
2 3 0.20 C B A 1 14 0.15 +0.05
-0.06 B 0.65
TOP VIEW END VIEW 1.00 REF
H -0.05
0.90 +0.15
-0.10 C GAUGE
PLANE 1.20 MAX
SEATING PLANE +0.05
0.25
5
-0.06
0.10 M C B A 0.10 C 0.25 0В°-8В° 0.05 MIN
0.15 MAX 0.60 В±0.15 SIDE VIEW …