Package Intersil M14.173 — Datenblatt
14 Blei Thin Shrink Small Outline Package
Package Outline Drawing (POD)
Parameter
Family | TSSOP |
Pin Count | 14 |
Length | 5.00 mm |
Thickness | 0.90 mm |
Height max | 1.20 mm |
Weight | 0.054 g |
Pitch | 0.65 mm |
Package Index | M14.173 |
Modellreihe
Serie: TSSOP (21)
Herstellerklassifikation
- Plastic Packages