Plastic Packages for Integrated Circuits
Small Outline Plastic Packages (SOIC)
M18.3 (JEDEC MS-013-AB ISSUE C) N
INDEX
AREA 18 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
H 0.25(0.010) M B M INCHES E
-B-1 2 3 L
SEATING PLANE -A-A D h x 45В° -C-e A1 B
0.25(0.010) M C
0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 -A1 0.0040 0.0118 0.10 0.30 -B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 -D 0.4469 0.4625 11.35 11.75 3 E 0.2914 0.2992 7.40 7.60 4 e О± B S 0.050 BSC 2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch) …
