Package Intersil L24.6x6 — Datenblatt

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP) L24.6x6
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220)
MILLIMETERS
SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.85 0.90 -A1 -0.025 -A2 -9 0.28 5, 8 A3
b 0.20 REF
0.18 0.23 9 D 6.00 BSC -D1 -9 D2 3.75 E 3.80 E1
E2 3.85 7, 8 6.00 BSC -3.75 e 3.80 9
3.85 7, 8
-0.80 BSC -k 0.25 -L 0.35 0.40 0.45 8 L1 -0.15 10 N 24 2 Nd 6 3 Ne 6 3 P -Оё -9
9
Rev. 0 12/05 NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature. …