Package Intersil L20.5x5 — Datenblatt

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP) L20.5x5
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 -A1 -0.02 0.05 -A2 -0.65 1.00 9 0.38 5, 8 A3
b 0.20 REF
0.23 0.30 9 D 5.00 BSC -D1 4.75 BSC 9 D2 2.95 E
E1
E2 3.10 3.25 7, 8 5.00 BSC -4.75 BSC
2.95 e 3.10 9
3.25 7, 8 -0.65 BSC -k 0.20 -L 0.35 0.60 0.75 8 N 20 2 Nd 5 3 Ne 5 3 P -0.60 9 Оё -12 9
Rev. 4 11/04 NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide …