Package Intersil L8.4x4B — Datenblatt

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.4x4B
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 0, 05/16
4.00 A 2.4 REF PIN #1 INDEX AREA 6X 0.80 BSC 5
B 1 8X 0.40 В±0.10 4 5
PIN 1
INDEX AREA 4.00 2.45 В±0.10 0.15 (4X)
5 8 0.10 M C A B
0.05 M C TOP VIEW 3 8X 0.30 В±0.05
3.38 В±0.10
BOTTOM VIEW 3.38
SEE DETAIL “X”
0.75 В±0.05
8X 0.60 0.10 C SEATING PLANE
0.08 C SIDE VIEW
(3.80) 2.45 4 0.2 REF
C 0.00 MIN.
0.05 MAX. (6X 0.8) DETAIL “X”
(8X 0.30) TYPICAL RECOMMENDED LAND PATTERN NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. …