Package Intersil L8.2x2D — Datenblatt
8-adriges Dual-Flat-Kunststoffgehäuse (DFN) mit freiliegendem Pad
Package Outline Drawing (POD)
Parameter
| Family | DFN |
| Pin Count | 8 |
| Thickness | 0.90 mm |
| Height max | 1.00 mm |
| Weight | 0.011 g |
| Peak Temperature | 240 °C |
| Lead Free Peak Temperature | 260 °C |
| Package Index | L8.2X2D |
Modellreihe
Serie: DFN (43)
- L10.3x2 L10.3x3 L10.3x3A L10.3x3B L10.3x3C L10.3x3D L10.4x4 L11.4x4 L12.3x3C L12.3x4 L12.4x3 L12.4x3A L12.4x4A L12.4x4B L12.4x4C L14.4x3 L16.5x3 L18.5x3 L20.4.0x5.5 L20.4x4I L20.5.5x4.0 L24.4x5 L24.4x5D L30.4x6 L6.1.6x1.6B L8.2.5x2 L8.2x2C L8.2x2D L8.2x2E L8.2x3 L8.2x3A L8.3x3A L8.3x3D L8.3x3G L8.3x3H L8.3x3I L8.3x3J L8.3x3K L8.4x4 L8.4x4B L9.3x3 L9.4x4 MDP0047
Herstellerklassifikation
- Plastic Packages