Package Intersil L12.4x4C — Datenblatt

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.4x4C 12 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 1, 3/15
4.00 2.5 REF A
PIN #1 INDEX AREA B 6 10x 0.50
1 6
12x 0.45 6
PIN #1
INDEX AREA 4.00 1.58 0.15 (4X)
12 7 0.10 M C A B
0.05 M C
4 12x 0.25 2.80 TOP VIEW BOTTOM VIEW SEE DETAIL "X"
(2.80) 12x 0.65 0.10 C C
SEATING PLANE
0.08 C 0.80 MAX SIDE VIEW (3.75) (1.58)
5
0.2 REF
C (10x 0.5) 0.00 MIN.
0.05 MAX. (12x 0.25) DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters. …