Datasheet TLC555 (Texas Instruments) - 6

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TLC555
SLFS043H – SEPTEMBER 1983 – REVISED AUGUST 2016
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply, V (2) DD 18 V Voltage Input, any input −0.3 VDD V Sink, discharge or output 150 mA Current Source, output, IO 15 mA C-suffix 0 70 °C I-suffix –40 85 °C Operating, TA Q-suffix –40 125 °C Temperature M-suffix –55 125 °C Case, for 60 seconds FK package –65 150 °C Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network GND.
7.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage, VDD 2 15 V TLC555C 0 70 °C Operating free-air TLC555I –40 85 °C temperature, TA TLC555M –55 125 °C TLC555Q –40 125 °C
7.3 Thermal Information TLC555 D FK JG P PS PW THERMAL METRIC(1) UNIT (SOIC) (LCCC) (CDIP) (PDIP) (SOP) (TSSOP) 8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 113 n/a 120 58 120 135 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58 37 81 48 72 61 °C/W RθJB Junction-to-board thermal resistance 55 36 110 35 69 77 °C/W Junction-to-top characterization ψJT 11 n/a 45 26 32 12 °C/W parameter Junction-to-board characterization ψJB 54 n/a 103 35 68 77 °C/W parameter Junction-to-case (bottom) thermal RθJC(bot) n/a 4.3 31 n/a n/a n/a °C/W resistance (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6 Submit Documentation Feedback Copyright © 1983–2016, Texas Instruments Incorporated Product Folder Links: TLC555 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information 7.4 Electrical Characteristics: VDD = 2 V for TLC555C, VDD = 3 V for TLC555I 7.5 Electrical Characteristics: VDD = 5 V 7.6 Electrical Characteristics: VDD = 15 V 7.7 Electrical Characteristics: VDD = 5 V 7.8 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Monostable Operation 8.3.2 Astable Operation 8.3.3 Frequency Divider 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Missing-Pulse Detector 9.2.1.1 Design Requirements 9.2.1.2 Detailed Design Procedure 9.2.1.3 Application Curve 9.2.2 Pulse-Width Modulation 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.3 Application Curve 9.2.3 Pulse-Position Modulation 9.2.3.1 Design Requirements 9.2.3.2 Detailed Design Procedure 9.2.3.3 Application Curve 9.2.4 Sequential Timer 9.2.4.1 Design Requirements 9.2.4.2 Detailed Design Procedure 9.2.4.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates 12.2 Community Resources 12.3 Trademarks 12.4 Electrostatic Discharge Caution 12.5 Glossary 13 Mechanical, Packaging, and Orderable Information