Datasheet LOC110 (Littelfuse) - 4

Not For New Designs
INTEGRATED CIRCUITS DIVISION
LOC110 Manufacturing Information Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard,
IPC/JEDEC J-STD-020
, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033
.
Device Moisture Sensitivity Level (MSL) Classifi cation
LOC110 / LOC110S MSL 1 LOC110P MSL 3
ESD Sensitivity
This product is
ESD Sensitive
, and should be handled according to the industry standard
JESD-625
.
Soldering Profile
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the C body temperature of this device may be above (T - 5)ºC. The classification temperature sets the Maximum Body C Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other processes, the guidelines of
J-STD-020
must be observed.
NFND Device Classifi cation Temperature (T ) Dwell Time (t ) Max Refl ow Cycles C p
LOC110 250ºC N/A LOC110S 250ºC 30 seconds 3 LOC110P 240ºC 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
4 www.ixysic.com
R11 Document Outline LOC110 xDisclaimer