Datasheet LT8418 (Analog Devices) - 9

HerstellerAnalog Devices
Beschreibung100V Half-Bridge GaN Driver with Smart Integrated Bootstrap Switch in WLCSP-12 package
Seiten / Seite19 / 9 — Data Sheet. LT8418. TYPICAL PERFORMANCE CHARACTERISTICS. 4.0. 3.5. 3.0. …
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Data Sheet. LT8418. TYPICAL PERFORMANCE CHARACTERISTICS. 4.0. 3.5. 3.0. 2.5. 2.0. I P. 1.5. 1.0. 0.5. VTGP, VBGP (V). TGN, VBGN (V)

Data Sheet LT8418 TYPICAL PERFORMANCE CHARACTERISTICS 4.0 3.5 3.0 2.5 2.0 I P 1.5 1.0 0.5 VTGP, VBGP (V) TGN, VBGN (V)

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Data Sheet LT8418 TYPICAL PERFORMANCE CHARACTERISTICS 4.0 8 3.5 7 3.0 6 2.5 5 ) ) (A (A K 2.0 K A 4 A E E I P I P 1.5 3 1.0 2 0.5 1 0 0 0 1 2 3 4 5 0 1 2 3 4 5 VTGP, VBGP (V) V
005
TGN, VBGN (V)
006
Figure 5. Peak Source Current vs. Driver Ouput Voltage Figure 6. Peak Sink Current vs. Driver Ouput Voltage 1k 100 VCC = 5V VCC = 5V DRIVE GS61008P FETs DRIVE GS61008P FETs 100 10 ) A ) A (m 10 (m C 1 T C S I V I B 1 0.1 0.1 0.01 1 10 100 1k 10k 1 10 100 1k 10k FSW (kHz)
007
FSW (kHz)
008
Figure 7. VCC Operating Current vs. Switching Frequency Figure 8. BST Operating Current vs. Switching Frequency 280 80 79 270 VIN = 6V 78 260 77 V 250 BST = 3.5V ) ) 76 A V A IN = 5V (µ T C 240 S 75 C _B _VIQ I Q 74 230 VIN = 3.5V 73 220 72 210 71 200 70 –40 –25 –10 5 20 35 50 65 80 95 110 125 –40 –25 –10 5 20 35 50 65 80 95 110 125 TEMPERATURE (°C)
009
TEMPERATURE (°C)
010
Figure 9. VCC Quiescent Current vs. Temperature Figure 10. BST Quiescent Current vs. Temperature analog.com
Rev 0 9 of 19 Document Outline Features Applications General Description Typical Application TABLE OF CONTENTS Revision History Specifications Timing Diagrams Absolute Maximum Ratings Thermal Resistance Pin Configurations and Function Descriptions Pin Descriptions Block diagram Typical Performance Characteristics Theory of Operation 1.1. Chip Start-up, VCC UVLO/OVLO Protections 1.2. Input Interface INT, INB 1.3. Smart Bootstrap (BST) Switch and BST UVLO 1.4. Split Gate Driver Applications Information 1.1. Selecting the VCC and BST Capacitor 1.2. Selecting the Gate Resistance 1.3. Power Dissipation 1.4. PCB Bypass and Grounding Guideline 1.5. Soldering Guideline Outline Dimensions Typical Applications Ordering Guide Related Parts