Datasheet TLVx197-Q1: TLV197-Q1, TLV2197-Q1, TLV4197-Q1 (Texas Instruments) - 7

TLV197-Q1 , TLV2197-Q1 , TLV4197-Q1 www.ti.com
SBOS935B – APRIL 2020 – REVISED JULY 2020
6.4 Thermal Information: TLV197-Q1 TLV197-Q1 THERMAL METRIC(1) DGK (VSSOP) UNIT 8 PINS
RθJA Junction-to-ambient thermal resistance 180.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance 67.9 °C/W RθJB Junction-to-board thermal resistance 102.1 °C/W ψJT Junction-to-top characterization parameter 10.4 °C/W ψJB Junction-to-board characterization parameter 100.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the Semiconductorand IC Package Thermal Metrics application report.
6.5 Thermal Information: TLV2197-Q1 TLV2197-Q1 THERMAL METRIC(1) DGK (VSSOP) UNIT 8 PINS
RθJA Junction-to-ambient thermal resistance 158 °C/W RθJC(top) Junction-to-case(top) thermal resistance 48.6 °C/W RθJB Junction-to-board thermal resistance 78.7 °C/W ψJT Junction-to-top characterization parameter 3.9 °C/W ψJB Junction-to-board characterization parameter 77.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the Semiconductorand IC Package Thermal Metrics application report.
6.6 Thermal Information: TLV4197-Q1 TLV4197-Q1 THERMAL METRIC(1) PW (TSSOP) UNIT 14 PINS
RθJA Junction-to-ambient thermal resistance 108.1 °C/W RθJC(top) Junction-to-case(top) thermal resistance 26.3 °C/W RθJB Junction-to-board thermal resistance 54.4 °C/W ψJT Junction-to-top characterization parameter 1.4 °C/W ψJB Junction-to-board characterization parameter 53.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the Semiconductorand IC Package Thermal Metrics application report. Copyright © 2020, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: TLV197-Q1 TLV2197-Q1 TLV4197-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: TLV197-Q1 6.5 Thermal Information: TLV2197-Q1 6.6 Thermal Information: TLV4197-Q1 6.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V) 6.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V) 6.9 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Input Protection Circuitry 7.3.2 EMI Rejection 7.3.3 Phase Reversal Protection 7.3.4 Thermal Protection 7.3.5 Capacitive Load and Stability 7.3.6 Common-Mode Voltage Range 7.3.7 Electrical Overstress 7.3.8 Overload Recovery 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 16-Bit Precision Multiplexed Data-Acquisition System 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.2.2 Slew-Rate Limit for Input Protection 8.2.3 Precision Reference Buffer 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Examples 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI (Free Software Download) 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Receiving Notification of Documentation Updates 11.5 Support Resources 11.6 Trademarks 11.7 Electrostatic Discharge Caution 11.8 Glossary 12 Mechanical, Packaging, and Orderable Information