Datasheet UCC33420 (Texas Instruments) - 5
| Hersteller | Texas Instruments |
| Beschreibung | 5V/5V 1.5W 3kVrms isolated DC-DC module with integrated transformer |
| Seiten / Seite | 37 / 5 — UCC33420. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. PIN. … |
| Dateiformat / Größe | PDF / 2.4 Mb |
| Dokumentensprache | Englisch |
UCC33420. www.ti.com. 6 Specifications 6.1 Absolute Maximum Ratings. PIN. MIN. TYP. MAX. UNIT. 6.2 ESD Ratings. VALUE

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UCC33420 www.ti.com
SLUSFK1E – JANUARY 2024 – REVISED FEBRUARY 2025
6 Specifications 6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
PIN MIN TYP MAX UNIT
VINP to GNDP, TA = -40°C to 105°C –0.3 6.5 V VINP to GNDP, TA = 105°C to 125°C –0.3 6.3 V EN/FLT to GNDP –0.3 6.5 V VCC to GNDS –0.3 6.5 V SEL to GNDS –0.3 6.5 V Total VCC output power at TA=25°C, VINP = 4.5V, VCC = 1.65 W 5.0V, POUT_VCC_MAX Total VCC output power at TA=25°C, VINP = 5.5V, VCC = 2.4 W 5.0V, POUT_VCC_MAX VCC maximum current sink capability 30 mA Operating junction temperature range, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ ESDAJEDEC JS-001(1) ±3000 V V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD2222-C101(2) ±1000 V (1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PIN MIN TYP MAX UNIT
VVINP Primary-side input voltage to GNDP 4.5 5.5 V VEN/FLT EN/FLT pin voltage to GNDP 0 5.5 V VVCC Secondary-side Isolated output voltage to GNDS 0 5.7 V VSEL SEL pin input voltage to GNDS 0 5.7 V PVCC VCC output power at VINP=5.0V±10%, VCC = 5.0V, TA=25°C - 85°C (1) 1.5 W PVCC VCC output power at VINP=5.0V±10%, VCC = 5.0V, TA=105°C (1) 1 W PVCC VCC output power at VINP=5.0V±10%, VCC = 5.0V, TA=125°C (1) 0.5 W Static Static Common mode transient immunity rating (dV/dt rate across the 200 V/ns CMTI isolation barrier) Dynamic Dynamic Common mode transient immunity rating (dV/dt rate across the 200 V/ns CMTI isolation barrier) TA Ambient temperature –40 125 ℃ TJ Junction temperature –40 150 ℃ (1) See the VCC Load Recommended Operating Area section for maximum rated values across temperature and VINP conditions for different VCC output voltage settings. Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: UCC33420 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Device Comparison 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Power Ratings 6.6 Insulation Specifications 6.7 Safety-Related Certifications 6.8 Safety Limiting Values 6.9 Electrical Characteristics 6.10 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Enable and Disable 7.3.2 Output Voltage Soft-Start 7.3.3 Output Voltage Steady-State Regulation 7.3.4 Protection Features 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout 7.3.4.2 Output Under-Voltage Protection 7.3.4.3 Output Over-Voltage Protection 7.3.4.4 Over-Temperature Protection 7.3.4.5 Fault Reporting and Auto-Restart 7.3.5 VCC Load Recommended Operating Area 7.3.6 Electromagnetic Compatibility (EMC) Considerations 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Application 8.2.1 Design Requirements 8.2.2 Detailed Design Procedure 8.3 Power Supply Recommendations 8.4 Layout 8.4.1 Layout Guidelines 8.4.2 Layout Example 9 Device and Documentation Support 9.1 Device Support 9.1.1 Third-Party Products Disclaimer 9.2 Documentation Support 9.2.1 Related Documentation 9.3 Receiving Notification of Documentation Updates 9.4 Support Resources 9.5 Trademarks 9.6 Electrostatic Discharge Caution 9.7 Glossary 10 Revision History 11 Mechanical and Packaging Information