Datasheet BC372, BC373 (ON Semiconductor)

BC372, BC373 High Voltage Darlington Transistors
NPN Silicon http://onsemi.com Features
• Pb−Free Packages are Available* COLLECTOR 3 BASE
MAXIMUM RATINGS
2
Rating Symbol Value Unit
Collector−Emitter Voltage VCEO Vdc EMITTER 1 BC372 100 BC373 80 Collector−Base Voltage VCES Vdc BC372 100 BC373 80
TO−92 CASE 29
Emitter−Base Voltage VEBO 12 Vdc
STYLE 1
Collector Current − Continuous IC 1.0 Adc 1 1 Total Power Dissipation @ T 2 2 A = 25°C PD 625 mW 3 3 Derate above TA = 25°C 5.0 mW/°C STRAIGHT LEAD BENT LEAD Total Power Dissipation @ TA = 25°C PD 1.5 W BULK PACK TAPE & REEL Derate above TA = 25°C 12 mW/°C AMMO PACK Operating and Storage Junction TJ, Tstg −55 to +150 °C Temperature Range
MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Symbol Max Unit
BC Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W 37x AYWW G Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W G Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. x = 2 or 3 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION Device Package Shipping
† BC372G TO−92 5000 Units / Bulk (Pb−Free) BC373RL1 TO−92 2000 / Tape & Reel BC373RL1G TO−92 2000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, *For additional information on our Pb−Free strategy and soldering details, please including part orientation and tape sizes, please download the ON Semiconductor Soldering and Mounting Techniques refer to our Tape and Reel Packaging Specifications Reference Manual, SOLDERRM/D. Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 4 BC372/D