NC7SZ14Pin Configurations NC 1 6 V NC 1 5 CC VCC A 2 A 2 5 NC GND 3 4 Y GND 3 4 Y Figure 2. SOT23−5, SC−88A and SC−74AFigure 3. MicroPak (Top Through View)(Top View)PIN DEFINITIONSFUNCTION TABLEPin # SC−88A /InputsOutputSC74A/SOT23−5Pin # MicroPakNameDescriptionAY 1 1, 5 NC No Connect L H 2 2 A Input H L 3 3 GND Ground H = HIGH Logic Level L = LOW Logic Level 4 4 Y Output 5 6 VCC Supply Voltage ABSOLUTE MAXIMUM RATINGSSymbolParameterMinMaxUnit VCC Supply Voltage −0.5 6.5 V VIN DC Input Voltage −0.5 6.5 V VOUT DC Output Voltage −0.5 6.5 V IIK DC Input Diode Current VIN < 0 V − −50 mA IOK DC Output Diode Current VOUT < 0 V − −50 mA IOUT DC Output Current − ±50 mA ICC or IGND DC VCC or Ground Current − ±50 mA TSTG Storage Temperature Range −65 +150 °C TJ Junction Temperature Under Bias − +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) − +260 °C PD Power Dissipation in Still Air SC−74A / SOT23−5 − 390 mW SC−88A − 332 MicroPak−6 − 812 MicroPak2™−6 − 812 ESD Human Body Model, JEDEC: JESD22−A114 − 2000 V Charge Device Model, JEDEC: JESD22−C101 − 1000 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. www.onsemi.com2