Datasheet CPC3710 (Littelfuse) - 4

INTEGRATED CIRCUITS DIVISION
CPC3710 Manufacturing Information Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard,
IPC/JEDEC J-STD-020
, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033
.
Device Moisture Sensitivity Level (MSL) Rating
CPC3710C MSL 1
ESD Sensitivity
This product is
ESD Sensitive
, and should be handled according to the industry standard
JESD-625
.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC3710C 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.
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R02 Document Outline CPC3710a Disclaimer