Datasheet FGD3050G2V (ON Semiconductor) - 8

DPAK3 6.10x6.54x2.28, 2.29P
CASE 369C ISSUE J DATE 12 AUG 2025
GENERIC MARKING DIAGRAM*
XXXXXXG AYWW ALYWW XXX XXXXXG
IC Discrete
XXXXXX = Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE 2. COLLECTOR 2. DRAIN 2. CATHODE 2. ANODE 2. ANODE 3. EMITTER 3. SOURCE 3. ANODE 3. GATE 3. CATHODE 4. COLLECTOR 4. DRAIN 4. CATHODE 4. ANODE 4. ANODE STYLE 6: STYLE 7: STYLE 8: STYLE 9: STYLE 10: PIN 1. MT1 PIN 1. GATE PIN 1. N/C PIN 1. ANODE PIN 1. CATHODE 2. MT2 2. COLLECTOR 2. CATHODE 2. CATHODE 2. ANODE 3. GATE 3. EMITTER 3. ANODE 3. RESISTOR ADJUST 3. CATHODE 4. MT2 4. COLLECTOR 4. CATHODE 4. CATHODE 4. ANODE
DOCUMENT NUMBER: 98AON10527D
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DESCRIPTION: DPAK3 6.10x6.54x2.28, 2.29P PAGE 2 OF 2 onsemi
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